Services

We offer several services with focus on testing the reliability and robustness of power-semiconductor devices. We can cover any needed packages or semiconductor materials. We can develop as well new test methods to fulfill specific customer needs when required. Please contact us for more detailed information

The following sections show an excerpt of the services that Chemnitz Power Labs can offer

Power Cycling/Thermal Cycling

PCsec and PCmin following the AQG 324
Discretes and power modules up to 2000 A maximum test current
Device technologies: SiC MOSFET, GaN HEMT, IGBT, diodes, …
Thermal cycling/thermal shock with 2 chamber system following AQG 324 or JEDEC, optional heat-plate cycling

Thermal Characterization

Precise measurement of the thermal impedance of discrete components, power modules, embedded assemblies
Characterization of different chip technologies is possible, e.g. GaN HEMT, IGBT, SiC MOSFET, diodes

H3TRB

Low-voltage and high-voltage tests are possible up to 6.5 kV device class
Different climate chambers available
Accurate in-situ measurement of the leakage current down to 100 nA

HTRB

Up to 6.5 kV device class, up to 200°C
Accurate in-situ measurement of the leakage current down to 100 nA

HTGB

Different test stations for HTGB, stepped HTGB or in the future AC-HTGB (DGS – dynamic gate stress, see AQG 324)
In-situ measurement of threshold voltage possible, pre-conditioning method following JEDEC JEP 184
Precise leakage current measurements

Characterization of Power Semiconductors

Static and dynamic characterization of power-semiconductor devices in close alignment with our clients
Curve tracer equipment available up to 10 kV and 1500 A
Short-circuit, avalanche (unclamped inductive switching) and surge-current measurements
Several types of SMUs (source-measurement units) available: single, double

Failure Mode Analysis of Power-Semiconductor Devices

Scanning acoustic microscopy of discrete components and power modules
Optical microscopy
Bond-wire pull tester with mapping
Decapsulation of packages (mold, silicone)